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ISBN
:
9780071374934
Publisher
:
McGraw-Hill Professional
Subject
:
Technology, Engineering, Agriculture
Binding
:
HARDCOVER
Pages
:
1000
Year
:
2001
₹
10663.0
₹
9170.0
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*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros andcons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
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