0

My Bag

0.00

₹

Download App

Design-for-test and Test Optimization Techniques for TSV-based 3D Stacked ICs 4.0%OFF

Design-for-test and Test Optimization Techniques for TSV-based 3D Stacked ICs

by Chakrabarty and Krishnendu

  • ISBN

    :  

    9783319023779

  • Subject

    :  

    Others

  • Binding

    :  

    Hardback

₹

11941.0

4.0% OFF

₹

11463.0

Buy Now

Shipping charges are applicable for books below Rs. 101.0

View Details

(Imported Edition) Estimated Shipping Time : 25-28 Business Days

View Details

Share it on

© 2016, All rights are reserved.

Subscribe to Our Newsletter

 

Are you sure you want to remove the item from your Bag?

Yes

No

Added to Your Wish List

OK

Your Shopping Bag

- 3 Items

null

Item

Delivery

Unit Price

Quantity

Sub Total

Shipping Charges : 0.0 Total Savings        : Grand Total :

Order Summary