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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
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ISBN
:
9780387765327
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Publisher
:
Springer
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Subject
:
Technology, Engineering, Agriculture, Technology: General Issues, Physics
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Binding
:
HARDCOVER
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Pages
:
422
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Year
:
2008
₹
18759.0
₹
18759.0
18759.0
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Description
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
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