Wiley Encyclopedia of Electrical and Electronics Engineering, 24 Volume Set plus Supplement 1

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The Wiley Encyclopedia of Electrical and Electronics Engineering, edited by John G. Webster, remains the most comprehensive and authoritative resource in the electrical and electronics engineering field to date. Key features of the Encyclopedia include: Each article written by expert in the field or disciplineWritten for both novice and expert--articles are structured to start with basic material and then move on to more complex theory and applicationsAll articles cross-referenced to related literature of further researchCovers history of electrical and electronics engineering, patents, computer engineering and much moreWiley is committed to ensuring that the online version of the Encyclopedia continues to reflect the state-of-the-art in engineering and computer science through frequently updating and expanding the Encyclopedia.If you are interested in contributing an article on one of the topics below, please contact the Associate Editor responsible for that technology. If your topic is not listed below, please contact Editor George Telecki at gtelecki@wiley.com.Additionally, as a contributor, you will receive free online access to the entire Encyclopedia for one year or any period thereafter during which you are actively preparing updates (or remain willing to do so upon the Editor’s request).Editorial PanelPOWER AND ENERGYMohammed ShahidehpourIllinois Institute of TechnologyMs@iit.eduADVANCED PACKAGINGGanesh SubbarayanPurdue UniversityGanesh@purdue.eduBahgat G. SammakiaBinghamton UniversityBahgat@binghamton.eduSENSORSEvgeny KatzClarkson UniversityEkatz@clarkson.eduMICROWAVE ENGINEERINGInder J. BahlInder.bahl@ieee.orgChris RodenbeckSandia National LaboratoriesChris.rodenbeck@gmail.comForthcoming ArticlesAuthorsOperation Reliability of Power SystemsWen Yuan LiHybrid and Plug-In Hybrid Electric Vehicles (PHEV)Ali EmadiPrice Forecasting Techniques in Power SystemsAntonio ConejoNanoantennasMarc Lamy de la ChapelleInterdisciplinary Operation of Natural Gas and Electric Power SystemsCong LiuState Estimation Security in Smart GridKui RenMiniaturized Microwave Fractal Filters (M2F2)Pierre JarryCarbon-Based Interconnects for RF NanoelectronicsWen-Yan YinPiezotronics and Piezo-phototronicsZhong Lin WangPiezoelectric Nanogenerators for Self-Powered Nanosensors and NanosystemsZhong Lin WangDesign of Transmit/Receive Switches in CMOSY.P. ZhangPower System Operator Training and SimulationRobin PodmoreArticles in PreparationPhasor Measurement Unit (PMU)Fault Detection and Just-In-Time Maintenance in Adjustable Speed DrivesEnergy HarvestingElectrical SafetyHome Automation TechnologyGraphene SensorsTomography SensorsUnconventional ComputingUnconventional information security systems (molecular keypad lock systems, barcodes etc)Electronic contacting of biomolecules (electrical “wiring” of proteins/enzymes)Implanted biofuel cells (biofuel cells operated in vivo in living organisms)Substrate Integrated Waveguide (SIW)Defected Microstrip StructureGaN HEMT Control CircuitsMetamaterial CircuitsWireless Power TransferArtificial Transmission LinesCrystal OscillatorsRadiofrequency IdentificationRadiofrequency Stability AnalysisTransmission LinesMonolithic Microwave Power AmplifiersWafer-Level, Chip-Scale, and Ball-Grid Array PackagingUnderfills, Die Attach Materials, Conductive AdhesivesFlexible Circuit Boards, Large Area ProcessingElectromigration Characterization and ModelingChip-Package Interaction CharacterizationCall for ContributorsTopics of InterestEnergy HubsElectrochemical BiosensorsCMOS MEMS SensorsImplantable SensorsDNA Based SensorsBiomimetic SensorsBiofuel CellsBiomolecular Materials for Electronic ApplicationsDNA computingSpintronicsDefected Ground Structure (DGS)GaN HEMT Power AmplifiersBehavioral Modeling of Microwave TransistorsThermal Design of Transistors and AmplifiersEvolutionary Optimization MethodsAdvances in Power SplittersAdvances in Branchline HybridsDelay LinesRF SiGe System on a ChipLinearization of Power AmplifiersInterconnect ModelingMixed-Signal CircuitsTunable FiltersElectromagnetic Virtual ToolsIntegrated RF TransceiversAdvances in Planar FiltersSolid State LimitersRF and Microwave PackageRF Multichip ModulesTerahertz TechnologyMicrowave Computer-Aided DesignRFIC Embedded TestAnalog-to-Digital Conversion (revise existing article)Global Positioning SystemMicrowave Digital FiltersGallium Nitride SemiconductorsDigital Wideband ReceiversHybrid Microwave CircuitsWafer-Scale PackagingRadiofrequency InductorsElectronics Supply ChainWaveguide FiltersPolarimetric RadarElectronics ManufacturingV-Band Transceivers and ApplicationsElectromagnetic SimulationSynthetic Aperture RadarCMOS Circuit DesignMagnetic Resonance Imaging (update to existing article "Biomedical NMR")RF/Microwave Biomedical ImagingHybrid Microwave Power Amplifiers3-D Packaging Including Implementations of TSVsSystem in Package (SIP)Flip-Chip and Fine Pitch Copper Pillar TechnologyHigh Density Substrates and BoardsOptoelectronic PackagingMEMS PackagingWireless PackagingAutomotive and Other Transportation ApplicationsLow Power Reduced Energy ApplicationsEmbedded PassivesLead-Free Solder Alloys - Material Choices and BehaviorThermal Interface MaterialsSpecial Materials: Nano-Structured Materials, Bio-Compatible MaterialsInterface Fracture Characterization and ModelingBoard-Level Reliability Characterization and Modeling (Thermal Cycling, Drop/Impact)Electrical Characterization of Packages